Foundry Service 

Nuvoton Foundry FAB

Nuvoton Foundry FAB (previous Winbond FAB2: 6 inch fab) has a capacity of 35,000 wafers per month for foundry service since year 2008.

Nuvoton Foundry FAB offers a variety of technologies including Generic Logic, Mixed Signal (Mixed Mode), High Voltage, Ultra High Voltage, Power Management, Mask ROM (Flat Cell), embedded Logic Non-Volatile Memory processes, etc. based on 0.35um to 0.6um technologies.As a semiconductor manufacturing foundry, our goal is to deliver excellent foundry capabilities as a manufacturing partner to fabless or fab-lite semiconductor companies.

Technology

Logic / Mixed mode Process

Embedded Logic Non-Volatile Memory (NVM) Process

Mask ROM Process

High Voltage / Power Process

Multi-Chip, Multi-Layer Mask Services

Multi-Chip and Multi-Layer Mask (MLM) services are available for engineering lot for all processes. The MLM service configures images form four design layers with similar mask specifications onto a single reticle. This service not only saves your development cost, but provides tape-out flexibility that customers can launch their tape-out product at any time without being dependent on pre-set prototyping schedules. Please contact with your account manager for further details, or send us an e-mail at the address below.

Contact us:  LogicFoundry@nuvoton.com

Shuttle Service

Shuttle Service offers platform for multiple customers sharing mask tooling costs through a multi-project wafer in prototyping product. Please contact with your account manager for further detail schedule, or send us an e-mail at the address below.

Contact us:   LogicFoundry@nuvoton.com

Design Service

Standard Cell Library: 0.35um and 0.5um Standard Cell Libraries are available.

Logic Non-Volatile Memory (NVM) IPs are available.

Design Kits:

* Further details about the technology, please contact with your account manager,or send us an e-mail at the address below.