Now, customers can easily identify our products offered in lead-free packaging by looking for our "Lead-Free" icon. To become familiar with lead-free packaging, here are some useful facts
	RoHS Roadmap Why Lead-free? Definitions Package Materials Impacted Solutions Lead-free Package Qualification Package Lead Free IR-Profile Samples Nuvoton Lead-free Marking Symbol Program Summary F A Q		RoHS Material Declaration Certificate Certificates: Sony Green Product ISO14001 OHSAS 18001

Why Lead-free?

• Legislation: European Union has established a phase-out date of July 1, 2006 for Pb in electronic products with some exceptions.
  
  
• RoHS (Restriction on Hazardous Substances) and WEEE (Waste Electrical and Electronic Equipment ) directives prohibit the usage of Lead , Mercury, Cadmium, Hexavalent Chromium, PBB and PBDE.
  
  
• Customer requirement: Sony and other companies have initiated a green procurement process which requires that all suppliers provide green products before established deadlines.

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Definitions

• Removal of lead (Pb) in package
• Lead-free package is ROHS compliance

• Removal of lead (Pb), antimony trioxide (Sb₂O₃) and brominated
  flame-retarding compound from encapsulants and substrates

• Pb < 1000 ppm
• Halogens (Cl, Br) < 900 ppm
• Antimony < 900 ppm

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Package Materials Impacted

Solutions

• Lead plating from Sn-37Pb to Matted Sn.
• Pre-plated lead frame (PPF) with Ni/Pd/Au finish.
• Solder ball from Sn-37Pb to Sn-4.0Ag-0.5Cu (US) or Sn-3.0Ag-0.5Cu (Japan).

• Halogens, Sb2O3, and Phosphorous free.
• Moisture resistance for 260C reflow temp.
• Phosphorous free

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Lead-free Package Qualification

Reliability Test Items:
1. Precondition:
    MSL Level III, 260 degree C

2. Temperature Cycle:
    -65°~150°/1000 cycles

3. High Temp. Storage:
    150/1000 hours

4. Temp Shock Test:
    -65°~150°/100 cycles

5. Pressure Cooker Test:
    121°/100% RH, 15 PSIG, 168 hours.

6. Other Tests:
    Solderability, Lead finish composition, Whisker test, etc

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Package Lead Free IR-Profile Samples

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Nuvoton Lead-free Marking Symbol

We will print lead free symbol on bar code label to identification of Pb free assemblies.

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Program Summary

• Nuvoton's lead-free program started in 6/2000
• Mass production of lead-free DRAM started in Oct. 2001.
• Our major assembly subcontractors are ready for lead-free package qualification and production.
• WEC's goal is to provide lead-free for all packages by Dec. 2005.
• All products have been converted to lead-free package since Jul. 2006.

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F A Q

• Pb-Free: Nuvoton's terms “ Lead-free” or ”Pb-free” mean semiconductor products that are
  compatible with current ROHS requirements for all 6 substances.
• Green: mean Pb-free and free of Bromine (Br) and Antimony (Sb) based flame retardants.
  
  

• Nuvoton product content website shows the current production status, package finish,
  and Pb-free and Green status of the individual parts
  
  

• Pricing is determined by product marketing. Conversion to Pb-free, in and of itself,
  is not planned to result in price changes.
  
  

• Yes.
  
  

• Yes, product part number will be changed for lead-free part.
  
  

• None expected.
  
  

• Our lead-frame based lead-free products are backward compatible with leaded soldering process.
  However, for BGA type lead-free products, it is not backward compatible with leaded soldering process.
  Solder joint reliability can be a concern.
  
  

• We have chosen matte tin as the lead finish for all lead-free products. The package is
  annealed within 24 hours at 150°C for 1 hour after lead plating. This is the industry-accepted
  method for mitigating tin whisker growth.

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