News & Events
March 01, 2007	Winbond America Introduces New USB Audio Controller IC Series for the Skype / VoIP Market
November 10, 2006	Cypress Teams With Winbond To Introduce Demonstration Kit For 2.4-GHz Wireless VoIP Headset With Best-In-Class Range And Performance
May 24, 2006	Winbond to Demonstrate Innovative “Showme” Family and Security Solutions for Microsoft Windows Vista at WinHec 2006
March 10, 2006	Winbond Introduces the Industry's Highest Performance Serial Flash Memories
March 01, 2006	Winbond America Introduces New Dual Programmable Extended CODEC/SLIC IC for the VoIP Market
December 07, 2005	Winbond Selected to the WiFi® Alliance WMM™ Power Save Official Testing Platform
October 10, 2005	Winbond joins the EWC
June 24, 2005	Winbond Aquires NexFlash Technology
March 16, 2005	Winbond Electronics to Acquire the Advanced PC Business Division from National Semiconductor
August 11, 2004	Winbond Introduces New Voice CODEC / RSLIC Chipset For Next Generation Voice Applications
July 14, 2004	Winbond Introduces New ISD1600 ChipCorder® Series Voice Record and Playback ICs
June 23, 2004	Winbond Introduces New Single-Channel 3V Linear CODEC For Next Generation Voice Applications
December 15, 2003	Winbond Introduces New Single-Channel 3V CODEC Chip For Mobile Voice Applications.
December 15, 2003	Winbond America Introduces New I5102/4 ChipCorder® Voice Record and Playback ICs.
December 10, 2003	Winbond Introduces New Telephone Answering IC Solution Aimed At Cordless Digital Phones.
December 08, 2003	Winbond Introduces New Voiceband CODEC Chip For USB Applications.