San Jose, CA, Sept. 3, 2003 Winbond Electronics
Corporation America, a leading supplier of semiconductor solutions,
today introduced the W681512, a single channel voice CODEC chip
aimed at telephony, communications and consumer applications requiring
analog-to-digital or digital-to-analog conversion. The W681512 is
part of a growing family of voice CODEC chip solutions that Winbond
offers. The chip is currently sampling and is competitively priced
at under $1.15 in 25,000 quantities.
The W681512 is suited for a wide variety of applications that
require voice converted to digital data including VoIP, telephony
and communications applications, said Boaz Efroni Rotman, CODEC
product marketing manager for Winbond America. The chip is based
on Winbonds advanced mixed-signal technology and as such, provides
a high-quality solution that is compliant with the latest industry
standards. In addition, the feature rich solution is extremely competitively
priced and offers very low power consumption.
The W681512 is a single channel CODEC for voice-grade, analog-to-digital
and digital-to-analog conversion. The voice CODEC includes a fully
differential output to minimize noise and is a drop-in replacement
for the Motorola MC145480 and MC14LC5480. In order to provide the
cleanest signal possible, the chip complies with ITU-T G.712 and
ITU-T G.711 industry standard specifications. The 5V IC features
low power consumption and enables system level customization. In
addition, in compliance with environmental mandates due to take
effect by 2006, the W681512 is the first in Winbonds voice CODEC
product line to be made available in lead-free packaging.
About Winbond
Winbond Electronics Corporation was founded in 1987 and is based
in Hsinchu Science-Based Park, Taiwan. It has since become the largest
branded IC Company in Taiwan, offering a broad range of PC and peripheral-related
ICs, consumer electronics ICs, multimedia ICs, and memory ICs. Winbond
is a market leader in the telephone dialer, PC I/O controller, memory,
speech synthesizer and MPEG
decoder markets. With three wafer fabs currently in operation, the
Company utilizes process technologies ranging from 1.0µm down
to 0.13µm. Winbond has approximately 4,000 employees worldwide
with design centers located in Hsinchu, Taiwan; Shanghai, China;
San Jose, California; and Austin, Texas. World Wide Web WECA home
page: http://www.winbond-usa.com; World Wide Web corporate home
page: http://www.winbond.com.
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Note: Winbond is a registered trademark of Winbond Electronics
Corporation. All other trademarks mentioned herein are the property
of their respective owners.
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