SAN JOSE, Calif. June
25, 2007 -- Winbond Electronics Corporation America, a
wholly owned subsidiary of Winbond Electronics Corp., today announced
production-release of the two newest members in its SpiFlash ® 25X
family of Serial Flash memories. Makers of computer, networking and
consumer applications now can take advantage of volume availability
of the recently introduced W25X16 and W25X32 SpiFlash ® memories --
whose 16 and 32 megabit densities, respectively, are housed in a
space-saving, cost-effective 8-pin SOIC package.
Utilizing Winbonds 0.13um Winstack technology, the W25X16 and
W25X32 SpiFlash ® memories build on the success of Winbonds popular
W25X family of SpiFlash ® memories (initially one- through
eight-megabit densities). The new devices feature the popular Serial
Peripheral Interface (SPI) supporting both Single-SPI and
Dual-SPI operation to achieve the industrys highest-performance
among Serial Flash memories. The W25X16 and W25X32 also include
uniform 4K-byte erasable sectors, in addition to earlier-generation
64KB blocks. The smaller 4K-byte sectors allow for efficient memory
allocation and storage of data, and are required in many Intel®-based
PC applications. Their packaging, performance and flexibility make
the W25X16 and W25X32 ideal Serial Flash solutions for a variety of
electronic applications, including desktop and notebook PCs, DVD
players and recorders, WLAN and DSL equipment, digital TVs,
set-top-boxes, printers, and industrial-control systems.
Next Generation Serial Flash
The 25X Dual-SPI feature, first introduced by Winbond in early
2006, has become a popular method for increasing SPI transfer rates
when shadowing code to RAM and, in some cases, even for executing
code directly from the SPI interface. Reflecting the market
acceptance of Winbonds groundbreaking work, several other
manufacturers have since announced Serial Flash memories with
Dual-SPI capability. The popularity of the 25X line has set the stage
for Winbonds next generation of SpiFlash ® memories featuring
Quad-SPI.
"Serial Flash offers considerable advantages in pin-count, space
and system cost, compared to parallel Flash," said Robin Jigour, vice
president of Serial Flash marketing at Winbond America. "However,
slower transfer rates have limited their acceptance in some
applications. The Dual-SPI feature is an effective first step but
much higher performance is still needed before Serial Flash can
overcome the performance advantages of parallel Flash memories.
To address this need, Winbond will introduce a new class of
high-performance Serial Flash memories later this year. The new
family features Quad-SPI with six times the transfer rate of standard
Serial Flash and greater performance than most parallel Flash
memories. This new line is targeted at applications that execute code
directly from the SPI bus to significantly reduce system costs.
Winbond will initiate this Quad-SPI family with a 16-megabit Flash
memory.
Serial Flash Market
Web-Feet Research, a leading market research firm tracking the
Flash memory industry, projects Serial Flash shipments in 2007 of 1.4
billion units, and greater than 2 billion units by 2009, surpassing
parallel NOR Flash unit sales. Over this time period 16Mb and 32Mb
Serial Flash applications will grow to 30 percent of the market. As
applications migrate from parallel to Serial Flash,
performance-enhancing features such as Dual- and Quad-SPI will become
increasingly important.
W25X16, W25X32 Ordering Information, Specifications
The W25X16VSSIG (208mil SO8) and W25X32VSSIG
(208mil SO8) are now in volume production. Alternate packages,
including 16-pin SOIC, 8-pad WSON, 8-pin DIP and Known Good Die (KGD)
on wafer, will also be supported. The W25X16 and W25X32 data sheet is
available at
http://www.winbond.com/hq/enu/ProductAndSales/ProductLines/FlashMemory/SerialFlash/SerialFlash/.For
specific lead-time, pricing and additional information, contact your
local Winbond sales office visit
http://www.winbond.com/hq/enu/ProductAndSales/WorldwideSales/WorldwideSalesOffices/
or email Winbonds Flash marketing group at spiflash_products@winbond.com
.
About Winbond
Winbond Electronics Corporation, a global company based in Hsinchu, Taiwan, is a leading supplier of semiconductor solutions. Winbond designs, develops, markets and sells IC solutions to the global electronics marketplace. The company’s primary mission is to serve the growing needs of manufacturers of computers, and consumer and communication electronics. Winbond Electronics Corporation has some 5000 employees worldwide with design centers in Hsinchu, Taiwan; Shanghai, China; San Jose, California; Austin, Texas; Japan and Israel. Winbond can be contacted via its corporate homepage at http://www.winbond.com.
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