SAN JOSE, Calif. Febuary
27, 2008 -- Winbond Electronics Corp., a leading supplier of semiconductor solutions to the consumer, computer, communications and electronics products markets, today introduced the industrys first four-channel CODEC optimized for short-loop VoIP applications. The newest member of Winbonds popular Pro-X (PROgrammable Extended) Series of CODEC/SLIC devices, the W684386 is a highly integrated solution to support four FXS telephone line interfaces on a single low-power CMOS device. The W684386 also delivers the industrys best idle channel noise and return loss performance benchmarks which VoIP-system makers are making a priority to reduce.
Optimized for short-loop applications, the W684386 targets the VoIP equipment market, including products such as high-density VoIP gateways, analog telephone adapters, voice-enabled DSL and cable modems, IP-PBX, FTTX systems, and set-top boxes.
As port densities on VoIP equipment increase dramatically with each generation, system designers are looking for a flexible solution with excellent price and performance benchmarks, said Ike Saeed, Vice President of Marketing of Winbonds Mixed Signal Product Center. The W684386 fills this need with a robust four-channel design that not only reduces system cost but also improves the clarity of the VoIP signals.
Proprietary Technology Delivers Versatility, Low Overhead, User-Friendliness
The W684386 leverages Winbonds proprietary CODEC/SLIC architecture, combining four programmable CODECs that enable the device to support a comprehensive set of signaling capabilities for telephone line supervision and control, offload processor overhead and offer designers a user-friendly signal-processing environment. The W684386s four-channel SLIC block supports programmable impedance matching and trans-hybrid balancing ensuring that worldwide compliance can be supported from a single hardware configuration.
The W684386 also incorporates programmable DC-to-DC controllers, which allow power consumption optimization on a per channel basis. The device can also support higher-density architectures with external ringing and centralized power options. Winbond's proprietary CODEC/SLIC is protected by U.S. Patent No. 7,260,212 issued August 21 2007.
Availability, Pricing
The W684386 is available now in a 128-QFP package, at $4.50 (10K quantities), with full production scheduled for Q2. Three evaluation boards are available, each featuring a different DC-to-DC architecture option (per-channel inductor-based, single transformer-based or external battery/external ringing architecture). Each evaluation board features Winbonds user-friendly PC-based Graphical User Interface (GUI). Samples and evaluation boards are available now from local Winbond sales offices and the companys authorized representatives.
Additional product information on the full Pro-X Series is available at http://www.winbond.com/
About Winbond
Winbond Electronics Corp. was founded in 1987 in Hsinchu Science Park, Taiwan. The company owns the capabilities of both IC design and manufacturing and provides entire solutions to the customers. Winbond focuses on the development of four main product lines, including µC & µC-based Consumer IC, Computer Logic IC, Mobile RAM, and Flash Memory, and it has built a solid foundation and a strong reputation in the semiconductor industry.
Winbond has five business groups, including Consumer IC Business Group, Computer Logic IC Business Group, DRAM Product Business Group, Flash Memory IC Business Group, and Memory IC Manufacturing Business Group. Each business group operates as a profit center to strengthen the companys operation model and keep the maneuverability and flexibility of the organization to adapt to the ever-changing semiconductor industry.
Winbond has over 4,000 employees worldwide and operates one 150mm wafer fab and one 300mm wafer fab. Winbond owns more than 2,500 patents worldwide and has subsidiaries in the USA, China, Israel, and Japan.
For more information, please visit: http://www.winbond.com
Note: Winbond is registered trademarks of Winbond Electronics Corp.. All other trademarks and copyrights mentioned herein are the property of their respective owners.